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7.

Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment · European Union

- Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), lead in solders for servers, storage and storage array systems (exemption granted until 2010), lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, lead in electronic ceramic parts (e.g. piezoelectronic devices).

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Source: EUR-Lex (Cellar) · retrieved 2026-10-12 · Text as adopted (Official Journal); later amendments are not incorporated in this text.