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ANNEX

2005/747/EC: Commission Decision of 21 October 2005 amending for the purposes of adapting to technical progress the Annex to Directive 2002/95/EC of the European Parliament and of the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment (notified under document number C(2005) 4054) (Text with EEA relevance) · European Union

Annex to Directive 2002/95/EC is amended as follows: point 7 is replaced by the following: ‘7. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications, lead in electronic ceramic parts (e.g. piezoelectronic devices).’; point 8 is replaced by the following: ‘8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC OJ L 186, 12.7.1991, p. 59. amending Directive 76/769/EEC OJ L 262, 27.9.1976, p. 201.’; relating to restrictions on the marketing and use of certain dangerous substances and preparations. the following points are added: ‘11. Lead used in compliant pin connector systems. 12. Lead as a coating material for the thermal conduction module c-ring. 13. Lead and cadmium in optical and filter glass. 14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’

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Source: EUR-Lex (Cellar) · retrieved 2026-10-12 · Text as adopted (Official Journal); later amendments are not incorporated in this text.