anx_ANNEX__point_1__text_2
‘7. Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead), lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications, lead in electronic ceramic parts (e.g. piezoelectronic devices).’;
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Source: EUR-Lex (Cellar) · retrieved 2026-10-12 · Text as adopted (Official Journal); later amendments are not incorporated in this text.