ANNEX
In the Annex to Directive 2002/95/EC, the following points 33 to 38 are added: ‘33. Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. 34. Lead in cermet-based trimmer potentiometer elements. 35. Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009. 36. Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010. 37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. 38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.’.
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Source: EUR-Lex (Cellar) · retrieved 2026-10-12 · Text as adopted (Official Journal); later amendments are not incorporated in this text.