anx_ANNEX__text_1
In Annex III, entry 15 is replaced by the following: ‘15 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages Applies to categories 8, 9 and 11 and expires on: 21 July 2021 for categories 8 and 9 other than in vitro diagnostic medical devices and industrial monitoring and control instruments; 21 July 2023 for category 8 in vitro diagnostic medical devices; 21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11. 15(a) Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies: a semiconductor technology node of 90 nm or larger; a single die of 300 mm^(2) or larger in any semiconductor technology node; stacked die packages with die of 300 mm^(2) or larger, or silicon interposers of 300 mm^(2) or larger. Applies to categories 1 to 7 and 10 and expires on 21 July 2021.’
Source: EUR-Lex (Cellar) · retrieved 2026-10-18 · Text as adopted (Official Journal); later amendments are not incorporated in this text.