ANNEX

In Annex III to Directive 2011/65/EU, point 7(a) is replaced by the following: ‘7(a) | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 30 June 2027. 7(a)-I | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1 A or greater or blocking voltages beyond 10 V, or die edge sizes larger than 0,3 mm × 0,3 mm | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-II | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met: — the thermal conductivity of the cured/sintered die-attach material is > 35 W/(m × K), — the electrical conductivity of the cured/sintered die-attach material is > 4,7 MS/m, — solidus melting temperature is higher than 260 °C | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-III | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) in first level solder joints (internal or integral connections – meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-IV | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) in second level solder joints for the attachment of components to printed circuit board or lead frames: (1) in solder balls for the attachment of ceramic ball-grid-array (BGA); (2) in high temperature plastic overmouldings (> 220 °C) | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-V | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) as a hermetic sealing material between: (1) a ceramic package or plug and a metal case; (2) component terminations and an internal sub-part | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-VI | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027. 7(a)-VII | Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for audio transducers where the peak operating temperature exceeds 200 °C | Applies to all categories (except applications covered by point 24 of this Annex) and expires on 31 December 2027.’

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Source: EUR-Lex (Cellar) · retrieved 2026-10-14 · Text as adopted (Official Journal); later amendments are not incorporated in this text.