Recital 10

Commission Delegated Directive (EU) 2025/1802 of 8 September 2025 amending Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in high melting temperature solders · European Union

(10) The technical and scientific assessment referred to in recital 9 identified seven areas of application covering the scope of the current exemption set out in point 7(a) of Annex III to Directive 2011/65/EU, namely internal interconnections in electrical and electronic equipment (‘EEE’), integral connections of die attach in EEE components, integral connections for components other than die to be mounted to sub-assemblies (first level solder joints), second level solder joints for the attachment of components to printed circuit board or lead frames, hermetic sealing materials, high melting temperature type solders in certain lamps, audio transducers. Those areas of application are further specified by technical conditions.

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Source: EUR-Lex (Cellar) · retrieved 2026-10-14 · Text as adopted (Official Journal); later amendments are not incorporated in this text.