anx_1__point_2__table

‘7(c)-V | Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions: (1) for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers; (2) for hermetic sealing between ceramic, metal and/or glass parts; (3) for bonding purposes in a process parameter window for < 500 °C combined with a viscosity of 1 013,3 dPas (‘glass-transition temperature’); (4) for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers; (5) for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs). | Applies to all categories and expires on 31 December 2027. 7(c)-VI | Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions: (1) for use in piezoelectric lead zirconium titanate (PZT) ceramics; (2) for providing ceramics with a positive temperature coefficient (PTC). | Applies to all categories (except applications covered by points 7(c)-II, 7(c)-III and 7(c)-IV of this Annex as well as point 14 of Annex IV) and expires on 31 December 2027.’

← (2) · All articles · doc__heading__3__para__5 →

Source: EUR-Lex (Cellar) · retrieved 2026-10-14 · Text as adopted (Official Journal); later amendments are not incorporated in this text.