anx_III__table__7

X.B.I.004 | Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects: a. Spacing, area, volume or height; b. Bill boarding; c. Components (presence, absence, flipped, offset, polarity, or skew); d. Solder (bridging, insufficient solder joints); e. Leads (insufficient paste, lifting); f. Tombstoning; or g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).

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Source: EUR-Lex (Cellar) · retrieved 2026-10-15 · Text as adopted (Official Journal); later amendments are not incorporated in this text.