anx_III__table__73

X.A.VIII.011 | “Decapsulation” equipment for semiconductor devices. Note: “Decapsulation” is the removal of a cap, lid, or encapsulating material from a packaged integrated circuit by mechanical, thermal, or chemical means.

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Source: EUR-Lex (Cellar) · retrieved 2026-10-15 · Text as adopted (Official Journal); later amendments are not incorporated in this text.