anx_III__table__9

X.C.I.002 | Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows: a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1, G-10, etc.); b. Multilayer PCB substrates, containing at least one layer of any of the following materials: 1. Aluminium; 2. Polytetrafluoroethylene (PTFE); or 3. Ceramic materials (e.g. alumina, titanium oxide, etc.); c. Etchant chemicals: 1. Ferric chloride (7705-08-0); 2. Cupric chloride (7447-39-4); 3. Ammonium persulphate (7727-54-0); 4. Sodium persulphate (7775-27-1); or 5. Chemical preparations specially designed for etching and containing any of the chemicals included in X.C.I.002.c.1 to X.C.I.002.c.4. Note: X.C.I.002.c does not control “chemical mixtures” containing one or more of the chemicals specified in entry X.C.I.002.c in which no individually specified chemical constitutes more than 10 % by the weight of the mixture. d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm; e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows: 1. Aromatic polyimides; 2. Parylenes; 3. Benzocyclobutenes (BCBs); or 4. Polybenzoxazoles.

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Source: EUR-Lex (Cellar) · retrieved 2026-10-15 · Text as adopted (Official Journal); later amendments are not incorporated in this text.