3.
the following points are added: ‘11. Lead used in compliant pin connector systems. 12. Lead as a coating material for the thermal conduction module c-ring. 13. Lead and cadmium in optical and filter glass. 14. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight. 15. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.’
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Source: EUR-Lex (Cellar) · retrieved 2026-10-12 · Text as adopted (Official Journal); later amendments are not incorporated in this text.